The activities of integration and test of the hermes payload resumed at FBK labs starting from the beginning of June 2020 with the preparation of the jigs needed for the integration, and the finalization of the procedure for the SDD reinforcement.
|1||Crystal Wrapping & crystal box assembly||2020 June 30. @FBK + INAF team|
|2||ABS and Kovar frame manufactorig||2020 July 7-13. @FBK|
|3||Glueing pf ABS and Kovar frame on SDD||2020 July 14-22. @FBK|
|4||Probe station measurements of reinforced SDDs||2020 July 16-24. @FBK + INFN Trieste|
|5||FEE PCB ASIC glueing||2020 July 16-20. @FBK|
|6||FEE PCB reinforced SDD glueing||2020 July 31 – Aug. 4. @FBK|
|7||FEE PCB bonding step 1||2020 Aug. 5-11. @FBK|
|8||FEE PCB ASICs electrical tests||2020 Aug.10-13. @FBK + INAF/PoliMI team|
|9||FEE PCB bonding step 2||2020 Aug. 14. @FBK|
|10||FEE PCB complete electrical tests||2020 Aug. 17-19. @FBK + INAF team|
|11||Crystal Box integration with FEE PCB||2020 Aug 21. @FBK + INAF team|
|12||Functional test detector system||2020 Aug. 24-26. @FBK + INAF team|
|13||Detector system transfer to Roma INAF/IAPS||2020 Aug. 27|
|14||Detector system characterisation||2020 Aug. 28 – Sept. 3 @INAF/IAPS|
2020 June 30
FBK Labs + INAF team
Before the integration of the scintillator crystals with the FEE-PCB, each crystal shall be individually wrapped with reflecting paper, and then assembled in 12 groups of 5 crystals each.
Insert one by one the 12 crystals groups into the rectangular slots.
Figures show the crystal box populated with 60 wrapped GAGG crystals.
2020 July 7-13
SDD are fragile and before integration needs to be reinforced. The solution chosen after many mechanical and thermal tests performed in the months of February, May and June 2020 is to use ABS+Kovar frames.
Both FEM+thermal analyses and tests in thermal chamber validated this solution.
ASICs bonding step1 is starting on July 30.
Followed activities will be developed soon.
- Electrilcal tests of ASICs
- Bonding step 2 (anodes)
- Functional tests with a Fe radiactive source
- Cristal box integration with FEE board and its support structure
- Detector system transfer to IAPS Roma
- Characterization test with hard X-ray sources.